IPC/JEDEC J-STDC. Handling, Packing,. Shipping and Use of. Moisture/ Reflow. Sensitive Surface. Mount Devices. A joint standard. IPC/JEDEC J-STDC-1 -. August IPC/JEDEC J-STDC -. February IPC/JEDEC J-STDB.1 includes Amendment 1 -. complies with ipc/JEDEc J-stDA. 3M™ HIC this card meets the IPC /JEDEC J-STD-. A standard. card size: 2” x 3” inches indicates: 5,10,15%.

Author: JoJotilar Akihn
Country: Bulgaria
Language: English (Spanish)
Genre: Medical
Published (Last): 27 February 2005
Pages: 166
PDF File Size: 14.63 Mb
ePub File Size: 9.70 Mb
ISBN: 548-9-18503-342-7
Downloads: 51665
Price: Free* [*Free Regsitration Required]
Uploader: Vojora

Blister onset temperature is dependent upon several factors, including wall thickness, percentage of moisture in the part, speed of connector heating, and peak temperature of the reflow process. The vapor pressure of moisture and other gases trapped inside the walls of a plastic connector increase rapidly when the connector is exposed to the high temperatures of solder reflow.

Proceed to Checkout Continue Shopping. Higher temperatures required for lead-free SMT soldering will force a change from many currently used connector housing resins, which will melt, suffer pin retention failures or fail to meet dimensional stability requirements. We have no amendments or corrections for this standard. Figures 1 and 2. Key to elimination of blistering is moisture control for most of the temperature-capable engineering resins used in connector housings.

By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life of 12 months from the seal date when using sealed dry bags. As the voice of the U.

The next phase will be lead-free solder compliance for board assembly. Many connector suppliers are eliminating, or have already eliminated, lead from their contact plating process. If all moisture absorption precautions are taken and connectors are still exhibiting some delamination during SMT assembly, measuring the amount of moisture in the parts to determine the steps required to solder without connector blistering may be required.


Please first log in with a verified email before subscribing to alerts. Effectiveness of desiccant on moisture absorption of packaged connectors. Subscription pricing is determined by: Some materials currently used may deform melt or show signs of delamination on the side walls, referred to as “blistering.

J-STD Bake Conditions

For ease of use, the halogen moisture analyzer was considered the best. This delamination is commonly referred to as a “blister. In this stage, the higher liquidus temperatures required for lead-free solders may have a profound effect on the connector insulator housings. Approved options include clay and silica gel.

The company compared three moisture measurement techniques: You can download and open this file to your own computer but DRM prevents opening this file on another computer, including a networked server.

They were subjected to two different storage conditions: You may delete a document from your Alert Profile at any time.


MBBs in two different thicknesses 0. All techniques provided similar moisture percentages in k. BoxEvansville, IN; Fax: Standards Subscriptions from ANSI provides a money-saving, multi-user solution for accessing standards. This standard is not included in any packages.

CARD, HUMIDITY INDICATOR, 5% 10% 15% RH, J-STDA | Arbell Electronics Distributor

Your Alert Profile lists the documents that will be monitored. Please first verify your email before subscribing to alerts. But the problems listed previously for connectors in jrdec hot oven environments can also result in board rework.


The higher preheat temperatures typical in lead-free solder profiles may provide more safety from blistering for thinner-walled parts than current tin-lead wtd profiles due to the direct relationship between moisture desorption rate and temperature.

The company has analyzed the types of bags that are available for connector packaging and come up with some recommendations based upon WVTR ratings Table ic. The key parameter in blistering of connector housings is the control of moisture absorption in the molded parts.

Board assemblers have focused on handling more expensive ICs but have failed to take similar precautions with board connectors.

Table 3 shows that, at the storage conditions of an air-conditioned warehouse in Southeast Asia Condition 1even the thinnest tested LDPE bag jevec provide enough moisture protection to keep the connectors below the blister threshold level for 90 days.

Lead-free solders result in higher peak temperatures, meaning more blistering. Many Asian OEMs, who have been converting to the lead-free solder process for the last few years, require that their connectors be packaged to minimize moisture absorption for this reason.